Various batch application

  - Alkaline / Acidic texturing
  - pSC1 / SC2 / O3 cleaning
  - Oxidation

High throughput

  - 600 wafers load 
  - up to 12,000 w/h

210

Capable Si wafer size

M6 (166 x 166mm)

M10 (182 x 182mm)

M12 (210 x 210mm)

High dosing accuracy

+/- 2%

Perfect Drying

Non metal component

Various inline application

  - RCA & O3 Cleaning
  - Developing / Etching

     / Striping

Various cleaning solutions

  - Roller brush / Disc brush
  - Bubble jet
  - Ultrasonic / Plasma

Capable glass size

Generation 7

Particle free design

Perfect Drying

Various batch application

  - RCA / SPM / HFO3 / DIO3 cleaning
  - Developing / Etchiong / Stripping
  - Oxidation / Special drying

Particle perfomance

  - RCA cleaning < 30EA
  - Dry < 30EA

Available for substrate

  - Si wafer up to 300mm

  - Glass / Ceramics up to 500x500mm

Perfect Drying

High dosing accuracy +/- 2ml

Non metal component